@inproceedings{inproceedings, title = {{Chip cracks during assembly: Finding and eliminating the critical defect}}, publisher = {{IEEE}}, url = {{}}, year = {{2011}}, month = {{7}}, author = {{Sauter W and Kaldor S and Clark J and Laforte S and McCarthy C and Restaino D and Casey J and Questad D}}, doi = {{10.1109/ectc.2011.5898559}}, isbn = {{9781612844978}}, journal = {{2011 IEEE 61st Electronic Components and Technology Conference (ECTC)}}, note = {{Accessed on 2025/03/14}}}